ABOUT TSiC
OUR VISION
To be a Regional Market Leader in providing Innovative Engineering Solutions to Semiconductor Industry.
OVERVIEW OF OUR GROUP
TSiC Berhad was incorporated on 19 September 2023 as a private limited company in Malaysia under the Companies Act 2016. Our Company was subsequently converted to a public limited company on 19 June 2024.
Our principal activity is investment holding. Through our subsidiary - BPE Synergy Engineering Sdn Bhd, we are principally involved in the repairing and replating of E&E products, and general management consultancy services.
We focus on semiconductor industry, providing on-site service support and headcount contract; PCB and mechanical design, fabrication and assembly; system integration; repair, replating and troubleshooting of PCBs and power supplies; as well as trading of components and parts.
Our Group structure
TSiC Berhad is a holding company with 100% ownership of BPE Synergy Engineering Sdn Bhd
A snapshot of our business model is as follows: -
Services
Service contract
- On-site service support
- Headcount contract
Project
- Mechanical design, fabrication and assembly
- Mechanical design fabrication and assembly
- System integration
Troubleshooting and repair
- Board sustain restoration
- Footprint sustain restoration (replating)
- Burn-in board maintenance
- Power supply and board troubleshooting
- Component level troubleshooting
Trading
Buying and selling of components and parts